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Applied Simulation Technology for NT 正式版

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Applied Simulation Technology for NT 正式版






Applied Simulation Technology for NT 正式版






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Applied Simulation Technology for NT 正式版

FOR WIN NT/WIN 2000

《Apsimtech 公司.專業積體電路設計/IC封裝軟體

Apsimtech 是一家專業的 EDA 公司, 主要針對 signal integrity
analysis, power integrity analysis as well as EMI/EMC and LCD
analysis, 尤其是 LCD Simulator 的超強功能,令人映像深刻!!!

絕對讓您愛不釋手,您還在等什麼!!!

完整原版對拷,絕對超值!

2002.02.10 ”火力光芒”上市 BY XYZ軟體補給站
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本站網址:[b]http://xyz566.com[/B]


【安裝說明】

安裝說明請參見光碟\crack

【軟體簡介】

Applied Simulation 產品在 IC 封裝上獨特的功能

1. IBIS LCR Extractor 可粹取BGA封裝上線路的LCR參數,並轉換成IBIS
DATA,供半導體廠商建立IBIS Model用(在北美已經是必要的)。

2. 可分析Imperfect Ground(基板上有許多Via Holes)。
雖然目前的BGA只有雙層,但在不久的將來,4層或6層以上基板已是常態。
屆時,VCC和GND兩層因貫穿孔的效應,使得等效電感增加。有較快的切換
速度時,因而產生電位差。VCC或GND層本身就有電位差,電路上各點因位
置的不同造成參考電位變動,進而產生雜訊。更重要的,EMI的COMMON
MODE NOISE最主要來源就是VCC和GND層。換句話說,VCC和GND層是IC的
EMI最大起源之一。若能完整分析並妥善控制VCC和GND貫穿孔的分佈,就
可以降低EMI的雜訊。國內某大CHIPSET製造廠委外封裝,現已要求對方分
析封裝的EMI效應,或交出佈局資料委由敝公司分析。若貴公司能提供VCC
和GND層的SPICE Model給客戶,他們必定對貴公司的技術能力和提供的服
務大加讚佩。據此,他們更能掌握整個IC的性能,並確保每支腳信號的完
整。

3. 非平行銅箔線的Crosstalk分析。
可以準確的分析非平行線(漸近或漸遠)的CROSS TALK。BGA封裝的佈線大都
是不規則狀且非平行線。

4. Simultaneous Switching雜訊分析。
現今的數位IC如CPU,CHIPSET和MEMORY都有數十DATA和ADDRESS BUS.當這些
BUS動作時,因Imperfect Groung的效應及寄生LCR效應,非常容易產生
Switching nosie。

5. 不規則狀銅箔線LCR參數粹取。
相較於電腦或通訊電路板數位信號的佈線,BGA基板的佈線呈不規則狀
ApsimALM可以精確的粹取不規則狀銅箔線的LCR參數。

6. 可自由選用UNIX或Windows NT版本。


ANOTHER GREAT TOOL for GREAT Engineers ...

http://www.apsimtech.com/product.htm

*** Apsim hasn't a spesific version for suite, it has sub version for its modules...
we list here all modules with their versions. ***

Applied Simulation Technology (Apsim) was established to develop software products
for the electronic design automation (EDA) market. Apsim's technological focus is
on developing products for signal integrity analysis, power integrity analysis as
well as EMI/EMC and LCD analysis with a major emphasis on accuracy.

Simulators :

ApsimSI v 3,300.3
(Advanced Signal Integrity Simulator)
can verify reflection and crosstalk noise along traces in layout designs using the
most accurate lossy coupled transmission line simulator ApsimSPICE, fast transmission
line parameter extractor ApsimRLGC and layout modeler ApsimLIF. ApsimSI is integrated
with PCB and MCM CAD systems.

ApsimRADIA v3.000.7
(EMC/EMI Radiated Emission Noise Simulation)
As clock frequencies in current designs increase, designers must take into account
signal reflections, crosstalk, and radiated emission noise (EMC/EMI). In the past,
radiated emission noise has been evaluated primarily by measurements of fabricated
products under operating conditions in an open or EMI testing location. The correction
of radiated emission noise problems discovered in this environment has required action
by highly experienced EMC/EMI experts. The work required to perform EMC/EMI control
is time consuming and may be quite costly if the correction causes a delay in product
releases. ApsimRADIA can be used to accurately predict radiated emission noise during
the design phase of a product.

ApsimRADIA-WB v3.000.1
(Design Workbench for EMI Analysis)
is a software modeling and simulation environment used by electrical designers or
EMI engineers to predict the correct EMI issues at the design stage. The engineer
can enter the physical interconnectlocations and simulate their effects from a
schematic diagram point of view. At the schematic level, changes to the electrical
parts, physical entities and locations can easily be made without complicated CAD
tools. Interactions of the physical locations of parts and electrical specifications
of the interconnects can be studied for adverse effects. ApsimRADIA-WB is designed
to evaluate the impact of electrical and physical characteristics on EMI. ApsimRADIA-WB
accurately predicts the radiated emissions from PCB, MCM, cables and subsystems.
As a result, the engineers can investigate EMI issues from a system point of view
as well. This avoids designs that work on a board basis but fail at the system level.
ApsimRADIA-WB provides insight into EMI issues resulting from physical placement,
electrical specifications, interconnects and physical entities such as connectors.
Design rules and conclusions leading better designs can then be made at the earliest
stage possible.

ApsimDELTA-I v5.000.2
(Ground/Power Plane Noise Simulator)
is a companion product to ApsimPLANE and is used for the analysis of Delta-I noise
or ground bounce in structures containing reference planes. It is interfaced to layout
systems so that the geometry is automatically generated in the form needed by the solvers.
ApsimDELTA-I defines terminals, calculates inductances and capacitances, and makes a
model of the structure. It then uses ApsimSPICE to plot the impedance as a function of
frequency. The model generated by ApsimDELTA-I is very compact so that ApsimSPICE
simulations take just seconds. The location and size of the decoupling capacitors can
be optimized from the impedance plots generated.

ApsimSPICE v3.300.3
(Advanced Circuit Simulator)
is based on the Spice3c1 program from the University of California at Berkeley.
ApsimSPICE is a high performance,easy-to-use, mixed-level mixed-mode circuit simulation
program that combines coupled, lossy transmission line analysis with improved SPICE
functionality, with special features to aid circuit designers at every step of the
design process. Taking advantage of ApsimSPICE features, engineers can improve their
analysis productivity, obtain accurate results with high-performance simulation and
improve the overall quality of their complex analog and digital designs. Because of the
accurate simulation produced by ApsimSPICE, engineers can identify hard-to-find design
errors and refine design ideas early in the product development process. Debugging takes
place before the first prototype is built, so fewer prototype revisions are needed to
produce a working design. As a result, engineers reduce design cycles, increase product
quality and reduce overall time to market.

ApsimOMNI v3.000.0
(Signal and Ground/Power Plane Analysis)
is a signal and power/ground modeling and simulation software system designed to evaluate
non ideal physical structure's impact on electrical performance. A shape based analog
layout modeler successfully converts arbitrary shaped signal and power/ground patterns
into readable models for the Apsim simulators. This allows the field solvers to accurately
model non-parallel signal and power/ground pattern interactions. The two capabilities allow
the tools to stimulate ground bounce noise and return path EMI noise.

ApsimR-PATH v3.000.0
(EMI Path Analyzer)
The major contribution to EMI is common mode radiation noise. The common mode noise is
caused by imperfect grounds such as slits and holes in ground and power planes. ApsimOMNI
can accurately simulate common mode noise. However, accurate analysis of common mode noise
needs powerful computers and very accurate nonlinear device models for power, ground and
signals. The major job of EMI engineers is to find current paths or current loops. Today
complex systems require layout engineers to avoid such large return current paths. To save
time to release products layout designers and even EMI engineers need to quickly recognize
the return current paths for their designed boards. ApsimRPATH is a unique simulator designed
to visualize the return current paths or current loops which are the major sources of EMI
troubles.

ApsimIBIS-LCR v4.000.1
(Electrical Characterization of IC Packages)
is an IC packaging modeling tool. ApsimIBIS-LCR does electrical characterization of various
types of IC packages including BGA, PGA, PLCC and others. The program reports such electrical
anomalies such as crosstalk, delay, inductance, and capacitance of a given package. The
program writes the resulting RLC entities in industry standard IBIS format. The IBIS data can
then be given out to end customers to consider these parasitics during timing or Signal
Integrity analysis. ApsimIBIS-LCR includes the ApsimSI tools so Signal Integrity issues of
the package can be analyzed with the program as well.

ApsimLCD v1.100.0
(Advanced LCD Simulator)
is a simulation environment which is used to facilitate the design and optimization of Flat
Panel Displays. The software provides tools for simulation and modeling of all the electronic
modules in a Flat Panel Display system. The steps in the design are: Pixel design, panel
electronics design and panel design. ApsimLCD combines physical microelectronic design with
electrical circuit simulation in a unique environment especially suited for LCD applications.
Tradeoffs in physical technology, TFT design and parasitic effects can be evaluated. The
results can be displayed for viewing angle, crosstalk and overall picture quality.

ApsimFDTD v1.000.1
(3D-full wave Electromagnetic Simulator)
is a "Finite Difference Time Domain" electromagnetic 3D full wave simulator. The program
solves Maxwell's equations in the time domain.

ApsimFDTD-SPICE v1.000.1
(Full Wave Non-linear Signal Integrity and EMI Solution)
is the first full wave electromagnetic field solver fully integrated with a non-linear circuit
simulator.

ApsimFDTD-SPAR v1.000.1
(Full Wave Electromagnetic Solver)
is an interconnect and power plane modeling tool used to accurately extract the elctrical
properties of the physical structures in PCB and IC designs.


MODELERS:

ApsimPLANE v1.400.3
(3d inductive field solver)
is a program for the analysis of structures including reference planes. Its primary use
is the extraction of inductances and resistances. These inductances are necessary, for
example, to do ground bounce calculations as well as find common mode currents for EMI/EMC
applications. Even at DC, the resistances are useful in predicting power flow in the board.
The input to ApsimPLANE is the description of the various ground (or reference) planes,
including the cutouts and via antipads, the various traces of interest, and other 3-D wire
elements such as bond wires and lead frames. The terminals or points on the reference planes
where external connections are made are also to be specified. The output is a ApsimSPICE
sub-circuit at the various terminals including those on the reference planes. An additional
output is the plot of the current distribution in the various ground planes.

ApsimRLGC v2.000.8
(2d+ capacitive field solver)
is program to calculate the electrical parameters of a transmission line cross section.
In particular it calculates the capacitance, inductance, resistance and conductance matrices
associated with coupled lossy transmission lines.

ApsimCAP3-D v1.100.3
(3d capacitive field solver)
is a 3D capacitance extraction tool, developed for electrostatic solutions of general 2D
and 3D systems of conducting bodies, surrounded by dielectric media. Given a system
containing N conductors, the program calculates an NxN capacitance matrix. By choosing one of
the conductors as a reference, the corresponding ApsimSPICE sub-circuit may be also obtained.
Both manual and auto-meshing are available. In the automeshing mode, the program can
utomatically mesh the structure so that the portions having finer detail have finer meshes.
ApsimCAP-3D can operate both in batch mode or through a well developed interactive user
interface, which allows the geometrical display of the structure under investigation. Input
file format is similar to ApsimRLGC.

ApsimSPAR v1.100.2
(Returns S-parameters)
is available as a separately licensed Apsim product which, when licensed in addition to
ApsimSPICE, includes the capability of producing automatically generated S-parameter outputs
from ApsimSPICE simulations. ApsimSPAR may be used in interactive and batch modes.

ApsimMPG v1.600.1
(Model Package Generator)
(for analog devices) and ApsimDMPG (for analog and digital devices) provides to workstation
users the capability of generating model parameters in the form of the .MODEL or .SUBCKT
statements for inclusion in the ApsimSPICE input files. This avoids the necessity of developing
these statements, with the required syntax, by hand. Model parameters may be extracted for
diode, BJT, power MOSFET, JFET, MESFET, operational amplifier, voltage comparator, voltage
regulator, and a number of digital driver/receiver devices by supplying the information as
requested by the program based on data book specifications.

ApsimIBIS-Translator v4.100.2
(IBIS to SPICE)
Signal integrity simulations are no more accurate than the models used. Because ApsimSI
utilizes ApsimSPICE, designers can build, use or modify the Apsim developed behavioral models.
The models consist of input and output non-linear I-V curves, arbitrary definable input/output
parastics, input-output DC transfer curves, logic functions, gate propagation delays and
rise/fall time synthesized models. Thus Apsim behavioral models can accurately simulate real
interactions of "Through-gates" and interconnections such as whole critical paths, while
conventional behavioral models evaluate phenomena "Between gates" only. ApsimSPICE supports
Berkeley SPICE transistor models for digital and analog circuits. ApsimMPG can extract
transistor parameters of discrete components. ApsimSI provides IBIS Translator which can
translate IBIS Data into Apsim behavioral models. Use of "s2ibis" developed by North Carolina
State University can transform digital ICs written in transistor models for Berkeley SPICE,
HSPICE and ApsimSPICE into "IBIS Data". ApsimSPICE's parser capability also can read
transistor-based digital circuit libraries provided by Texas Instruments which uses HSPICE
syntax for sub-circuit parameter passing and Berkeley SPICE LEVEL=3 and HSPICE LEVEL=13
mosfet models.

ApsimTSG v1.000.5
(Table SPICE Generator)
automatically writes out SPICE transistor level models in EIAJ IMIC format. IMIC-Interconnect
Modeling for Integrated Circuits-is an emerging standard for describing circuits and
interconnects in a standardized manner. The standard is used for the modeling and simulation
of Signal Integrity and EMI issues. The models produced by the tool retain SPICE topology and
accuracy without disclosing semiconductor proprietary process information. IC vendors can
integrate the program with existing SPICE programs to obtain the models.

ApsimIBIS-Took Kit v4.100.2
(SPICE to IBIS)
is a program that writes industry standard IBIS models for use in Signal Integrity analysis.
IBIS is the emerging standard for SI simulation in the EDA market. IC vendors however have
been reluctant to start full support of the standard due to two primary reasons. One, there
is a lack of software to both automate and verify the IBIS modeling syntax at the commercial
level. Secondly, there exists a wide gap between IC manufacturer's SPICE models and IBIS
tools. SPICE is the IC industry's standard for transistor modeling. However to date no
commercial software has been made available to accurately translate SPICE models into the IBIS
format. The result is that system designers are forced to consider expensive modeling solutions.

http://www.apsimtech.com/product.htm



認明 > 版,一定讓你值回票價,保證錯不了。

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對您工作上真正有幫助,敬請務必要買原版軟體,以支持
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Applied Simulation Technology for NT 正式版

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